Samsung Reveal a Plan to Speed up Delivery of AI chips Soon

Samsung Electronics has unveiled a strategy to accelerate the delivery of AI chips by providing a one-stop-shop for clients. This integrated solution combines Samsung's top-ranked memory chips, foundry services, and chip packaging capabilities to capitalize on the AI boom.

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Samsung Leaks Reveal a Plan to Speed up Delivery of AI chips

By streamlining communication between these teams through a single channel, Samsung has reportedly reduced AI chip production time by around 20%.

The company's contract manufacturing business aims to offer a seamless experience for clients by leveraging its strengths in memory chips, foundry services, and chip packaging. This approach is expected to be a significant advantage in the market, particularly as the demand for AI chips continues to grow.

Samsung forecasts the global chip industry revenue to reach $778 billion by 2028, driven by the growing demand for AI chips.

Samsung's advanced chip architecture, gate all-around (GAA), is crucial for creating more powerful chips for AI applications. The company has already begun implementing GAA and plans to mass-produce its second-generation 3-nanometer process in the second half of 2023.

Additionally, Samsung has announced its latest 2-nanometer chipmaking process for high-performance computing chips, featuring power rails on the backside of the wafer to enhance power delivery. Mass production of this process is scheduled for 2027.

The company's efforts to enhance its AI capabilities are also reflected in its recent announcements. Samsung revealed its process technology roadmap, including two new nodes — SF2Z and SF4U — as well as its integrated Samsung AI Solutions platform using the strengths of its Foundry, Memory, and Advanced Package (AVP) businesses.